groene appel schreef op 6 juli 2022 10:37:
Hybrid Bonding Update Since Last Analyst Meeting
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• BESI moved from proof of concept to quantity shipments
• AMD’s first hybrid bonded 3D chiplet-based processor (RYZEN) commercially available
• Multiple customer engagements
Logic customers have moved to volume production:
• First hybrid system shipped to major memory IDM in Q2-22
Memory is starting proof of concept:
• Expanded activities and customer engagement at Singapore Center of Excellence
• BESI and IMEC signed JDA
Research Centers:
• Expanding capacity to potential 15-20 systems per month
• Production leadtimes reduced from 6 months to 3 months
• Development & service staff organized to support customer production in US & Taiwan
• Preparing cluster tool solution with AMAT to enable next level productivity