Romano99 schreef op 16 augustus 2024 09:04:
Interessant sukje uit de CC van AMAT gisteravond:
Gary E. Dickerson -- President, Chief Executive Officer, and Director
Hi, Harlan. Thanks for the question. So, heterogeneous integration is one of the biggest areas of focus for Applied and for the entire industry. At our AI event, along with AMD at SEMICON, there was a discussion around driving 100x improvement in energy-efficient computing.
So, again, this is the big race that everybody is focused on. And certainly, packaging is a key part of that. So, we're in deep engagements, really, you know, multiple technology nodes, five, 10 years out into the future. And there's going to be tremendous innovations.
If you look even at new DRAM technologies like 4F2 or high-bandwidth memory, you're going to see adoption of hybrid bonding technologies that are going to be really important for those parts of this ecosystem. And you mentioned what's happening from a logic standpoint. So, I think the great thing for Applied is we have this broad portfolio in packaging. We have, as you mentioned, the hybrid bonding, digital lithography.
We have other new technologies in the pipeline that even expand our portfolio further. We have an advanced full flow packaging lab in Singapore, where we're driving co-innovation with our customers to accelerate those architecture inflections. So, I think this is going to be one of the most exciting segments of the market going forward. We're at about $1.7 billion today.
We've talked about doubling the packaging revenue over the next few years. And I think it's going to keep going from there. Again, this is a really key part of the industry drive for energy-efficient computing.