www.roodmicrotec.com

1. Ronson 19 april 2009 22:22

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   • Ronson

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   Nieuwe website RoodMicrotec: www.roodmicrotec.com
2. [verwijderd] 20 april 2009 10:48

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   geen handel vandaag?
3. [verwijderd] 20 april 2009 11:41

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   quote:

   bruinsma schreef:

   geen handel vandaag?
   

   jawel hoor:
   11:06:21 0,1800 18000
   11:06:17 0,1890 280
   10:58:23 0,1890 3500
   10:58:23 0,1890 2500
   10:45:06 0,1890 26550
   
   
4. Ronson 22 april 2009 00:04

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   • Ronson

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   Astride the Packaging Roadmap
   The National Microelectronics Institute (NMI) and TWI are organising the fourth in a series of annual one-day seminars addressing microelectronics packaging trends, technologies and applications which is being hosted at TWI, Granta Park, Great Abington, Cambridge. The 2009 seminar, which is to be held on Wednesday 22nd April 2009, focuses on the Microelectronics Packaging Roadmap and has been timed to coincide with the recent publication of the 2009 Global Packaging Roadmap by the International Electronics Manufacturing Initiative (iNEMI) who are headquartered in the USA.
   
   The seminar will include a keynote address from iNEMI to introduce their 2009 Packaging Roadmap and technical presentations addressing both packaging applications and technologies of interest to the UK microelectronics design and manufacturing community in the area of wireless communications, power and automotive electronics.
   
   The seminar is kindly sponsored by Unisem and is also supported by the Photonics KTN and by IMAPS UK.
   
   This Packaging Roadmap seminar is aimed at system designers, device designers, packaging and interconnection engineers, technology developers, device and systems applications engineers in the electronics, photonics and sensors industries. The seminar provides a unique opportunity to gain an overview of UK and global packaging technology requirements, capabilities and trends and to network with colleagues, design and technology providers in this key technology area.
   
   The provisional seminar programme is as follows:
   08.30 Coffee and Registration
   09.10 Welcome and Introduction
   Paul Jarvie, NMI
   David Pedder, TWI
   09.30 Keynote - The iNEMI Roadmap 2009, Grace O’Malley, iNEMI
   10.30 Refreshment break, networking, tabletops
   11.00 A package fit for purpose, tba, CSR
   11.30 Packaging Technologies for Power Electronics, David Newcombe, Dynex Semiconductor
   12.00 Lunch, networking, tabletops
   13.30 Access to Packaging – a Case Study ‘RoodMicrotec’, Thorsten Bucksch, RoodMicrotec
   14.00 Package technology development for SiP, Alan Evans, Unisem
   14.30 System-in-Package and Passive Integration - options and directions, David Pedder, TWI
   15.00 Refreshment break
   15.30 Influence of Package Choice on your System Reliability, Nick Renaud-Bezot,
   Serma Technologies
   16.00 Close
   
   www.twi.co.uk/content/e220409.pdf
5. Ronson 22 april 2009 00:09

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   • Ronson

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   LASER World of Photonics 2009
   15. - 18. Juni 2009 in München
   
   Mitaussteller: Agfa-Gevaert HealthCare GmbH, CINOGY GmbH, Collischon Optik-Design, Dausinger + Giesen GmbH, DD-Optik GmbH, design!struktur, Feldmann GmbH, Fraunhofer-Institut für Mikroelektronische Schaltungen und Systeme IMS, Fresnel Optics GmbH, GD Optical Competence GmbH, Günter-Köhler-Institut für Fügetechnik und Werkstoffprüfung GmbH, IB/E Optics Ing.-Büro Klaus Eckerl, ilis gmbh, Ingenieurbüro Goebel GmbH, inno-spec GmbH, ISCO Precision Optics GmbH, J. Hauser GmbH & Co. KG, Korth Kristalle GmbH, Leica Microsystems CMS GmbH, Luphos GmbH, Mahr GmbH, Micreon GmbH, Optikkomponenten & Kristalle GmbH, Plöckl GmbH & Co. Industrieoptik KG, Roodmicrotec / microtec GmbH, SUMITA OPTICAL GLASS EUROPE GmbH, TEC Microsystems GmbH, TGZ Halbleitertechnologie an der Universität Stuttgart, Wirtschaftsförderungsgesellschaft mbH Region Ostwürttemberg (WiRO)
   
   www.optecnet.de/news/presse/kompetenz...