Signetics Corp.

1. [verwijderd] 25 januari 2013 14:15

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   Signetics Announces Plan to Double Their Flip Chip Package Assembly Capacity to Support Smartphones and Other Fast Growing Consumer Applications
   
   Paju, South Korea, 3 December 2012
   
   Signetics Corporation today announced that it has approved capex plans and has ordered equipment that will double their capacity for Flip Chip Package Assembly at their factory in Paju, South Korea. The new Flip Chip expansion will be qualified by January 2013 and will be ready for volume production in February 2013. The centerpiece of this new equipment is the Quantum 8800 Flip Chip bonder by Datacon. This bonder allows for finer bump pitches below 100um and is compatible with the 95mm PCB format.
   
   www.signetics.com/en/
   
   "The centerpiece of this new equipment is the Quantum 8800 Flip Chip bonder by Datacon"
2. [verwijderd] 25 januari 2013 14:40

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   Fab Equipment Spending: Positive Growth for 2012
   and 2013; All-Time Record for 2013
   
   Breaking the barrier
   into positive growth for
   2012, the end-of-May edition
   of the SEMI World Fab Forecast
   shows improved growth
   in fab equipment spending
   this year – at US$ 39.5 billion,
   a two percent yearover-
   year (YoY) increase.
   For 2013, fab equipment
   spending is expected to reach
   an all-time record high, with
   $46.3 billion or 17 percent
   growth from 2012.
   
   Even with
   a small growth rate, 2013
   will yield an all-time record
   high for fab equipment
   spending, if macro-economic
   factors do not intervene.
   R egions planning to spend
   the most on fab equipment
   in 2012 are: Korea (over $11
   billion), Taiwan ($8.5 billion),
   and the Americas ($8.3
   billion). In 2013, the largest
   spending is expected again in
   Korea (over $12.5 billion),
   the Americas (over $11.5 billion),
   and Taiwan (over $8
   billion). All product types
   are increasing equipment
   spending in 2012 with the
   largest increase seen in 2012
   for Memory and Foundry.
3. [verwijderd] 25 januari 2013 15:16

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   • 2009 acquisition, restructuring and Asian production transfer
   have transformed company and earnings potential
   • Advanced packaging, smart phone/tablet growth and Asian
   production transfer offer significant upside potential
   • Stock market valuation at significant discount to peers
   
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